ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,048, issued on Aug. 4, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Encapsulated package with exposed electrically conduc... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,049, issued on Aug. 4, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Electrical circuit body, power converter, and electrical c... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,050, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and metho... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,051, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and metho... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,052, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Frame edge reinforcement structure fo... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,053, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of manuf... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,054, issued on Aug. 4, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Yuko Nakamata (Matsu... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,055, issued on Aug. 4, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module with bent external terminal" was inve... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,056, issued on Aug. 4, was assigned to Marvell Asia Pte Ltd (Singapore). "Flanged stiffener ring" was invented by David M. Bond (Apex, N.C.)... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,057, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass core patches embedded in encapsulating material for package... Read More